Capabilities

• Photoplots at 2000 & 4000 dpi
• State of the art dry film imaging
• .004 mil lines, .004 mil spacing
• .007 mil min hole size
• LPI soldermask
• Special Dialectrics
• Multi-layer boards up to 14 layers
• Board thickness from .020 to .125
• Copper weight from 1/2oz to 4oz
• N/C route and scoring
• Surface mount 2 sides
  
• Blind / buried vias
• Internal and external heat sinks
• Selective or full immersion nickle, gold, silver and tin plating
• R.O.H.S. compliant (Lead Free Solder - E.N.I.G.)
• Conductive carbon / paste
• AOI (Automated Optical Inspection)
• Bare board testing, through hole and surface mount
• Net List, Clam Shell and Bed of Nail testing
• TDR Polar (Controlled Impedance) testing
• Rogers, Teflon, G-tek and Polymide materials
• 24 hour turn available on 2 to 4 layer boards
• We gaurantee delivery and quality
• IPC-A-600 (Certified)
• ISO 9001:2008
• Class 2 & 3
• 94V-0 & MOT-130
• UL Listed and approved